Cathode assembly with localized profiling capabilities

ABSTRACT

An improved cathode assembly specifically designed to provide for the uniform, localized profiling of dopant or other alterant elements into the host matrix of a semiconductor alloy material which is continuously and uniformly deposited onto a moving substrate by a glow discharge deposition process.

FIELD OF THE INVENTION

This invention relates generally to apparatus adapted to continuously deposit layers of semiconductor alloy material, and more particularly, to a cathode assembly specifically designed to provide for the uniform, localized profiling of dopant or other alterant elements into the host matrix of a semiconductor alloy material which is continuously deposited in a glow discharge deposition chamber.

BACKGROUND OF THE INVENTION

The instant invention, as disclosed and described herein, relates to apparatus for continuously depositing layers of semiconductor alloy material onto a substrate in each of at least one deposition chamber through which the substrate is adapted to successively travel. In the preferred embodiment, the deposition of amorphous semiconductor alloy material is accomplished by glow discharge deposition techniques in which a gaseous precursor material is decomposed and recombined into molecular species and compounds under the influence of an electromagnetic field developed in the plasma region of the deposition chamber. The composition of the amorphous semiconductor alloy material deposited onto the substrate is dependant upon, not only (1) the composition of the particular gaseous precursor material which is introduced into the deposition chamber, but also (2) the particular molecular structure of the molecular species and compounds at the time of introduction into the plasma region, (3) the manner in which those molecular species and compounds react when subjected to the electromagnetic field, (4) the rate at which those molecular species and compounds are depleted during the decomposition and deposition process, and (5) the length of time those molecular species and compounds are subjected to the electromagnetic field prior to deposition onto the substrate. It should therefore not be surprising that it is important to carefully monitor and control, not only the relative quantities and compositions of the various gaseous precursor materials introduced into the plasma region of the deposition chamber, but also (1) the molecular structure of the semiconductor alloy material deposited across the entire surface area of the substrate and (2) the length of time the various molecular species and compounds are subjected to the electromagnetic field prior to the depletion thereof. To the end of controlling the composition of the gaseous precursor materials introduced into the plasma region, the deposition chamber is sealed from atmospheric conditions, pumped to a relatively low pressure, heated to high temperatures, and flushed with gaseous hydrogen, argon or nitrogen prior to initiation of the glow discharge process. The deposition chamber may further be preferably, but optionally, equiped with a precathode assembly for (1) removing contaminants from walls of the chamber and impurities from the gaseous precursor material and initiating the disassociation and (2) recombination of the gaseous precursor materials prior to the time that those materials flow into the plasma region. The concept of a precathode assembly has been fully disclosed in the U.S. patent application Ser. No. 452,224 filed Dec. 12, 1982, entitled "Upstream Cathode Assembly" assigned to the Assignee of the instant patent application and the subject matter of which is incorporated herein by reference. Said precathode assembly, fully described therein, substantially solved the problem of uniformity of the layers of semiconductor alloy material which were deposited in both static and batch-type glow discharge deposition systems. Further, U.S. Pat. No. 4,479,455 filed Mar. 14, 1983, entitled "Reaction Gas Introduction and Channeling System", also assigned to the assignee of the instant patent application, and the subject matter of which is also incorporated by reference, dealt with and substantially solved the problem of providing uniformity (across the entire surface of a large area substrate) of the deposited semiconductor alloy layers in deposition systems employing a continuously moving substrate.

In order to more fully understand the problems associated with the deposition of profiled semiconductor alloy layers which must exhibit uniform optical, electrical and chemical characteristics over large areas (at least approximately one square foot), it is necessary to describe, in greater detail, sophisticated process gas introduction systems, such as the system illustrated and described in U.S. patent application Ser. No. 475,289, mentioned hereinabove. Note that when discussing the uniform deposition of semiconductor alloy material, it is common to refer to the development of an electromagnetic field by the transmission of electromagnetic energy to a cathode or antenna, the field being formed between the deposition cathode or antenna and a grounded substrate spaced therefrom. The area in which this electromagnetic field acts will hereinafter be referred to generally and interchangeably as either the "decomposition region" or the "plasma region". It is upon entering this plasma region and being subjected to the electromagnetic field that the gaseous precursor materials are disassociated and recombined into an ionized plasma made up of molecular species and compounds of the originally introduced gases. The ionized gaseous species and compounds are deposited onto the heated surface of said substrate as it passes through the plasma region of the deposition chamber. In order to avoid the problem which was previously encountered when using glow discharge processes to deposit semiconductor alloy material onto a moving substrate, even when the deposition apparatus was equipped with the precathode assemblies, i.e., the problem of having semiconductor alloy material deposited adjacent the upstream section of the cathode (that section of the substrate first contacted by process gases introduced into the plasma region) exhibit different (non-uniform) optical, electrical and chemical characteristics than the semiconductor alloy material deposited at more downstream sections of the cathode (those sections of the cathode later contacted by the process gases as they pass through the plasma region), the gaseous precursor materials were introduced and made to flow through the plasma region in a direction which is substantially parallel to the direction of travel of the web of substrate material through the plasma region of the deposition chamber. Further note, that while the direction of flow of the gaseous precursor material through the plasma region is described as parallel to the direction of movement of the substrate therethrough, that direction of flow may be either in the same direction of movement or in an opposite direction of movement relative to the web of substrate material.

Regardless of the direction of flow, i.e., as long as the gaseous precursor materials are made to flow in a direction substantially parallel to the direction of travel of the web of substrate material, the semiconductor alloy material deposited thereonto, although graded (cross-sectional slices of the material taken in a direction parallel to the plane of the web of substrate material as it travels through the deposition chamber may vary in homogeniety with respect to one another), is substantially "uniform" (cross-sectional slices of the material taken in a direction perpendicular to the plane of the web of substrate material, which slices comprise an aggregation of the graded layers, exhibit substantially similar chemical, optical and electrical properties). This uniformity was achieved because the gaseous precursor materials present at any arbitrarily selected line extending across the entire transverse width of the web of substrate material are substantially identical and therefore the gaseous precursor materials which are present adjacent any arbitrarily selected line extending across the entire transverse width of the web of substrate material are subjected to the effects of the electromagnetic field established between the cathode and the web of substrate material for substantially identical lengths of time. The molecular species and compounds formed from those disassociated and recombined gaseous precursor materials, being at substantially identical stages of disassociation and recombination, are therefore deposited onto the entire surface of the web of substrate material as a film of substantially uniform semiconductor alloy material, which material exhibits said substantially uniform optical, electrical and chemical properties.

Referring now specifically to FIGS. 3A, 3B, 4A, and 4B, the shortcomings of aforementioned U.S. patent application Ser. No. 475,289 with respect to the deposition of profiled layers of semiconductor alloy material will be described. As illustrated in FIG. 3A, the cathode assembly of a glow discharge deposition chamber, such that of the '289 application, is depicted generally by the reference numeral 50. In the cathode assembly 50, the web of substrate material 11 is shown moving in the direction of arrow A across, but spaced from, the cathode plate 34 as the gaseous precursor semiconductor material is introduced to flow from the gas inlet manifold 36 operatively disposed beneath the cathode plate 34, around a first edge of that cathode plate 34, through the plasma region developed between the upper surface of the cathode plate 34 and the moving web of substrate material 11, about the distal edge of the cathode plate 34 and through an exhaust 41 operatively disposed therebeneath. As previously mentioned, by introducing the gaseous precursor semiconductor material into the plasma region of the deposition chamber in a direction substantially parallel to the plane of travel of the moving web of substrate material 11, the deposited semiconductor alloy material, if measured by cutting cross-sectional slices in a direction transverse to the plane of the web of substrate material, would exhibit substantially uniform properties across the entire length and width dimensions thereof. Further, the semiconductor alloy material deposited onto the web of substrate material 11 in any given deposition chamber is an aggregation of the semiconductor alloy material deposited on an infinite number of hypothetical lines, each line extending across the width, and substantially parallel to the plane, of the web of substrate material 11. It is this aggregation of layers, each layer of which (being of infinitely small cross-sectional thickness) is of substantially uniform and homogeneous chemical composition, while adjacent layers differ from one another in uniformity and chemical composition. In summary then, while the deposited semiconductor alloy material might be non-uniform and vary in optical, electrical and/or chemical characteristics if, as above, a plurality of cross-sectional slices of that deposited material were taken in a direction parallel to the plane of the web of substrate material 11 and those slices were compared, the deposited semiconductor alloy material would be substantially uniform, graded and exhibit similar optical, electrical and chemical characteristics if a plurality of cross-sectional slices were taken in a direction perpendicular to the plane of the web of substrate material 11 and then compared.

The shortcomings of the construction of the cathode assembly 50 of FIG. 3A, previously alluded to, may now be explained with reference to the elongated, transversely extending, profiling gas manifold 52 positioned at the downstream end of the cathode plate 34. The profiling gas manifold 52 preferably includes a plurality of spaced apertures for introducing the profiling gases across the entire width of the decomposition region in a direction, depicted by the reference arrow D, said direction of flow of the profiling gases being substantially parallel to the direction of movement of the web of substrate material 11 through the decomposition region of the glow discharge deposition chamber, but opposite to the direction of flow of the gaseous precursor material through that decomposition region. The utilization of this type of profiling gas introduction system was believed to be diffusion limited by the flow of the relatively small amounts of profiling gas in a direction opposite to the direction of flow of the relatively high amounts of primary gaseous precursor semiconductor material through the decomposition region. In this manner, the flow of the primary gaseous precursor semiconductor material was used to restrict the levels of profiling gas reaching and traveling through downstream regions of the decomposition region. The concentration of profiling gas present in localized areas of the decomposition region would thereby vary in the direction D of the flow of the profiling gas. More particularly, the greatest concentration (albeit, a very low concentration) of profiling gas is located adjacent the downstream (relative to the direction of travel C of the gaseous precursor material) section of the decomposition region. Due to ( 1) the deposition of some of the profiling gas as that gas is subjected to the effects of the electromagnetic field developed in the decomposition region, and (2) the difficulty the profiling gas experiences in moving against the flow of the gaseous precursor material in reaching upstream locations within the decomposition region, the concentration of the profiling gases decreases with the upstream movement thereof through the decomposition region. In this manner, it was thought that by introducing, for instance, a p-dopant gas through the profiling manifold 52, the greatest amount of p-dopant gas would be deposited directly atop the p-doped semiconductor alloy layer just entering the, for instance, intrinsic deposition chamber 30. As the web of substrate material 11 moves through the decomposition region of that hypothetically intrinsic chamber 30, lesser amounts of p-dopant profiling gas are present and therefore deposited onto the web of substrate material. In this manner, the profiling of the intrinsic semiconductor alloy layer with successively lesser amounts of p-doped material from the p-dopant/intrinsic junction to the intrinsic/n-dopant junction is accomplished.

Referring to FIG. 3B, the profile of, for instance, the deposited p-doped semiconductor alloy material is illustrated by the solid line indicated by the reference numeral 56, while the dashed line 58 refers to semiconductor alloy material introduced into the downstream portion (relative to the direction of travel of the web of substrate material 11) of the decomposition region of the slow discharge deposition chamber through an elongated gaseous precursor material introduction manifold 54 (shown in phantom outline in FIG. 3A). More particularly, the second introduction manifold 54, is intended to introduce a gaseous precursor material into the plasma region, which material, when subjected to the effects of the electromagnetic field established between the cathode and the web of substrate material 11, is decomposed and deposited, in a graded manner, onto that web of substrate material 11 more quickly than the gaseous precursor semiconductor material introduced into the decomposition region from the main gas introduction manifold 36. Because of the more rapid deposition of the additional gaseous precursor material introduced through introductory manifold 54, the gaseous species introduced therefrom are continuously being depleted before reaching the downstream portions of the decomposition region, and hence are graded into the host matrix of the semiconductor alloy material which is simultaneously deposited onto the web of substrate material 11.

Turning now to FIGS. 4A and 4B, the cathode region of a further embodiment of a glow discharge deposition chamber disclosed in U.S. Pat. No. '455 is depicted generally by the reference numeral 60, said cathode region representing a mirror image of the gas introduction and channeling system described with reference to FIGS. 3A and 3B. This mirror-image gas introduction and channeling system can be employed to provide for the profiling of n-dopant gases for grading, the intrinsic/n-dopant junction of a p-i-n type photovoltaic device. More particularly, in FIG. 4A the web of substrate material 11 is again moving through the decomposition region in a direction of travel depicted by arrow A, however, the gaseous precursor semiconductor alloy material introduction manifold 36' is now operatively disposed so as to direct the flow of the semiconductor alloy gases through the decomposition region in the direction of arrow C', that direction being substantially parallel to and in the same direction as the direction of travel of the web of substrate material 11, vis-a-vis, the opposite direction in which the semiconductor alloy gases were made to flow through the decomposition region of FIG. 3A. After passing through the decomposition region, the semiconductor alloy gases are removed through an exhaust 41 disposed beneath the cathode plate 34. Grading of the dopant material in the semiconductor alloy host matrix is achieved through the use of a profiling gas introductory manifold 52' which is again adapted to introduce gaseous profiling material to flow through the decomposition region in the direction of arrow D', which direction of flow is generally opposite to the direction of flow of the semiconductor alloy gases through the decomposition region of the deposition chamber. However, the gaseous profiling material is now deposited at the downstream end of the glow discharge deposition chamber (relative to movement of the web of substrate material 11 therethrough) so that the gaseous species from the profiling gas manifold 52' are deposited adjacent the top surface of the depositing layer of semiconductor alloy material. More particularly, and viewing FIG. 4B, the semiconductor alloy material is shown deposited with a profiled or graded layer incorporated into the host matrix thereof by the solid line 56', which line is intended to indicate that the gaseous profiling material diffuses a given distance into the decomposition region with the least amount of gaseous profiling material being deposited into the semiconductor alloy layer at an upstream location (upstream relative to the movement of the web of substrate material 11 through the decomposition region).

As the web of substrate material 11 continues to move toward more downstream portions of the glow discharge deposition chamber, the amount of gaseous profiling material present in the plasma, as well as the amount of gaseous profiling material deposited onto the web of substrate material 11 continually increases so as to reach a maximum at the most downstream location (a location closest to the profiling gas introductory manifold 52'). The profiling or grading indicated by the phantom line 58' in FIG. 4B represents the deposition of a secondary gaseous precursor material from an elongated introductory manifold 54', generally similar in structure and function to introductory manifold 54 described with reference to FIG. 3A. The secondary gaseous precursor material is of the type that when subjected to the electromagnetic field developed between the web of substrate material 11 and the cathode plate 34 tends to decompose and deposit onto the web of substrate material 11 at a rate greater than the rate of deposition of the primary gaseous semiconductor alloy material introduced into the decomposition region from the manifold 36'. In this manner, the source of a secondary gaseous precursor material introduced from the introductory manifold 54' is depleted before that material can travel very far into the plasma region and hence, is graded or profiled into the depositing semiconductor alloy material. However, the secondary gaseous precursor material is graded into the bottom portion of the semiconductor alloy material (as compared to FIG. 3B in which it was graded into the upper portion thereof).

Whereas the aforementioned gas channeling and introducing systems of the glow discharge deposition chambers of FIGS. 3A and 4A were operative to deposit the aforedescribed profiles of dopant gases or secondary gaseous precursor materials, as indicated by the profiling curves of FIGS. 3B and 4B, said gas introductory systems were (1) limited to the deposition of only the precise profiles illustrated in FIGS. 3B and 4B, (2) unable to deposit the gaseous precursor species in any preselected and/or localized segments of the semiconductor alloy material, and (3) unable to deposit any preselected concentration of secondary gaseous precursor species within a given profile. For instance, it might be desirable to deposit, rather than a profiled layer of additional gaseous precursor material, a uniform layer of additional gaseous precursor material in the first deposited 1000 angstroms of the intrinsic semiconductor alloy material, or a graded layer thereof in the intermediate 1000 angstroms of intrinsic semiconductor alloy material, or a uniform layer thereof in the final 1000 angstroms of deposited intrinsic semiconductor alloy material. The prior gas introductory systems were simply not equipped to provide such alternatives of either graded or uniform disposition of a secondary gaseous precursor material at any desired location in the host matrix of the depositing semiconductor alloy material.

As a further, more specific example, it is desirable that in a tandem photovoltaic device, the more narrow band gap photovoltaic cell be formed by incorporating germanium into the host matrix of the silicon alloy material. However, it has been determined that germane gas, the gaseous precursor material from which the germanium is deposited, decomposes and is deposited onto the web of substrate material at a rate much greater than the rate of deposition of the silane gas, the gaseous precursor material from which silicon is deposited thereonto. Accordingly, the germane gas is depleted before reaching the end of the plasma region. Even by initially introducing a large rate of germane gas into the plasma region, more germane gas is incorporated into the host matrix of the silicon alloy adjacent the introductory manifold portion of the decomposition region than adjacent the exhaust region thereof. Therefore, it it were desired either to deposit a uniform layer of silicon-germanium alloy material onto the substrate, or to deposit a graded layer of silicon-germanium alloy material in the middle 1000 angstroms of deposited material, such prior gas channeling and introductory system would be incapable of accomplishing same. With the process gas introductory systems of FIGS. 3A and 4A, it would be impossible to avoid producing areas of the plasma region which were rich in the presence of germane gas while more downstream areas of the plasma region would be poor or depleted in the presence of said germane gas. Of course, the deposited semiconductor alloy material would correspondingly show upstream (relative to the germane gas introductory manifold) areas of rich germanium incorporation and downstream areas of depleted germanium incorporation in the host matrix thereof.

In addition to the aforementioned shortcomings of the gas channeling and introductory systems of FIGS. 3A and 4A, the most significant operational limitation of said prior art channeling and introductory systems resulted from the use of an elongated cathode which was specifically deployed in the chambers adapted for the deposition of the relatively thick layers of intrinsic semiconductor material. More specifically, since (1) the layer of intrinsic semiconductor alloy material may be as thick as about 3500 angstroms in a tandem photovoltaic cell, (2) the rate of deposition of said intrinsic semiconductor alloy material is relatively slow, (3) said intrinsic semiconductor alloy material is deposited continuously upon a moving web of substrate material, and (4) the doped layers of semiconductor alloy material may be less than about 100 angstroms thick, the cathode plates in the intrinsic deposition chamber past which the web of substrate material spacedly travels must be as much as about six feet in length. In order to insure that the amount of the gaseous precursor source of the primary semiconductor alloy material is not depleted at the downstream end of such an elongated plasma region, the velocity of the primary semiconductor alloy material introduced into the cathode region of the deposition chamber is substantially increased. Of course, since the rate of flow of the primary semiconductor alloy material is increased and the gaseous precursor dopant material can only be present in trace amounts in the host matrix of the intrinsic semiconductor alloy material, the flow rate of said gaseous pecursor dopant material introduced into the cathode region of the deposition chamber in a direction of travel parallel, but opposite to the direction of flow of the primary semiconductor alloy material, cannot be correspondingly increased so as to diffuse the preselected distance through the plasma region (against the oppositely directed flow of the primary semiconductor alloy material). The reason that the introductory flow rate of the gaseous precursor dopant material cannot be increased is that any such increase would cause too much of said dopant material to be deposited adjacent the manifold from which said dopant material is introduced. The consequential result was that the gradation of dopant profiling gas throughout at least a portion of the depositing layer of semiconductor alloy material could not heretofore be reliably controlled.

Recently, considerable efforts have been made to develop processes for depositing amorphous semiconductor films, each of which can encompass relatively large areas, and which can be doped to form p-type and n-type materials for the production of p-i-n-type devices substantially equivalent to those produced by their crystalline counterparts.

It is now possible to prepare amorphous silicon semiconductor alloys, by glow discharge or vacuum deposition techniques, said alloys possessing (1) acceptable concentrations of localized states in the energy gaps thereof, and (2) high quality electronic properties. These techniques are fully described in U.S. Pat. No. 4,226,898, entitled Amorphous Semiconductors Equivalent to Crystalline Semiconductors, issued to Stanford R. Ovshinsky and Arun Madan on Oct. 7, 1980; by vapor deposition as fully described in U.S. Pat. No. 4,217,374, issued to Stanford R. Ovshinsky and Masatsugu Izu, on Aug. 12, 1980, under the same title; and in U.S. Pat. No. 4,517,223 entitled Method Of Making Amorphous Semiconductor Alloys And Devices Using Microwave Energy by Stanford R. Ovshinsky, David D. Allred, Lee Walter and Stephen J. Hudgens. As disclosed in these patents, it is believed that fluorine introduced into the amorphous silicon semiconductor operates to substantially reduce the density of the localized states therein and facilitates the addition of other alloying materials, such as germanium.

The concept of utilizing multiple cells, to enhance photovoltaic device efficiency, was discussed at least as early as 1955 by E. D. Jackson, U.S. Pat. No. 2,949,498 issued Aug. 16, 1960. The multiple cell structures therein discussed utilized p-n junction crystalline semiconductor devices. Essentially the concept is directed to utilizing different band gap devices to more efficiently collect various portions of the solar spectrum and to increase open circuit voltage (Voc.). The tandem cell device has two or more cells with the light directed serially through each cell, with a large band gap material followed by a smaller band gap material to absorb the light passed through the first cell or layer. By substantially matching the generated currents from each cell, the overall open circuit voltage is the sum of the open circuit voltage of each cell while the short circuit current remains substantially constant.

Hamakawa et al, reported the feasibility of utilizing Si-H in a configuration which will be defined herein as a cascade type multiple cell. The cascade cell is hereinafter referred to as a multiple cell without a separation or insulating layer there between. Each of the cells was made of an Si-H material of the same band gap as in a p-i-n junction configuration. Matching of the short circuit current (J_(sc)) was attempted by increasing the thickness of the cells in the serial light path. As expected, the overall device Voc increased and was proportional to the number of cells.

It is of obvious commercial importance to be able to mass produce photovoltaic devices such as solar cells. However, with crystalline cells mass production was limited to batch processing techniques by the inherent time consuming growth requirements of the crystals. Unlike crystalline silicon which is limited to batch processing for the manufacture of solar cells, amorphous silicon semiconductor alloys can be deposited in multiple layers over large area substrates to form solar cells in a high volume, continuous processing system. Continuous processing systems of this kind are disclosed, for example, in pending patents and applications: U.S. Pat. No. 4,400,409, filed May 19, 1980 for A Method of Making P-Doped Silicon Films and Devices Made Therefrom; U.S. patent application Ser. No. 244,386 filed Mar. 16, 1981 for Continuous Systems For Depositing Amorphous Semiconductor Material; U.S. Pat. No. 4,410,558 filed Mar. 16, 1981 for Continuous Amorphous Solar Cell Production System; U.S. Pat. No. 4,438,723 filed Sept. 28, 1981 for Multiple Chamber Deposition and Isolation system and Method; and U.S. Pat. No. 4,462,332 filed Mar. 19, 1982, for Method And Apparatus For Continuously Producing Tandem Amorphous Photovoltaic Cells. As disclosed in these applications, a substrate may be continuously advanced through a succession of deposition chambers, wherein each chamber is dedicated to the deposition of a specific material. In making a solar cell of p-i-n-type configuration, the first chamber is dedicated for depositing a p-type amorphous semiconductor material, the second chamber is dedicated for depositing an intrinsic amorphous semiconductor material, and the third chamber is dedicated for depositing an n-type amorphous semiconductor material.

It is for use with continuous deposition apparatus such as the systems described in the patent and patent applications cited hereinabove that the Cathode Assembly With Localized Profiling Capabilities of the present invention is directed. When equipped with the instant cathode assembly, said deposition apparatus is adapted to deposit uniform layers of semiconductor alloy material, said layers being precisely profilable in any specified manner regardless of the length of the cathode plates in any given deposition chamber.

These and further objects and advantages of the present invention will become clear from the drawings, the claims and the description of the preferred embodiment which follow.

BRIEF SUMMARY OF THE INVENTION

There is disclosed herein an improved cathode assembly for the glow discharge deposition of thin film layers of semiconductor alloy material onto substrate material, said substrate material adapted to continuously travel through the plasma region of a deposition chamber developed by the glow discharge. At least one gaseous precursor semiconductor alloy material is adapted to be introduced into the plasma region of the deposition chamber. The improvement comprises the introduction of at least a first additional gaseous precursor material into at least only localized areas of the plasma region so as to deposit any selected profile of the first additional gaseous precursor material into the depositing layer of semiconductor alloy material. The gaseous precursor source of semiconductor alloy material is adapted to be channeled so as to be introduced into and flow through the plasma region in a direction of travel which is substantially parallel to the direction of movement of the substrate material. A second additional gaseous precursor material may be introduced into only localized areas of the plasma region so as to deposit any selected profile of the second additional gaseous material into the depositing layer of semiconductor alloy material. The cathode assembly includes an elongated, generally planar cathode plate operatively spaced from the substrate material so that the plasma region is developed as the gaseous semiconductor material flows through the space formed between the substrate material and the cathode plate. The cathode plate is apertured and the at least first additional gaseous precursor material is adapted to be introduced into the at least only localized areas of the plasma region through localized apertures in the cathode plate.

A cathode shield is provided for assuring that the direction of flow of the gaseous semiconductor alloy material is from an introduction manifold disposed beneath the cathode, around the first edge of the cathode plate, into and through the plasma region developed across the top surface of the cathode plate, around the distal edge of the cathode plate, and through an exhaust disposed beneath the cathode plate. The first additional gaseous precursor material is introduced through a plurality of spaced manifold assemblies, each of which is an elongated member operatively disposed so as to extend transversely across the entire width of the cathode plate. Each of the manifold assemblies includes a plurality of spaced outlets along the entire length thereof for introducing the at least one additional gaseous precursor material into the plasma region. In this manner, the first additional gaseous precursor material is introduced into at least one localized area of the plasma region, which area is coextensive with the width of the cathode plate. The manifold assemblies are disposed beneath the apertured cathode plate and are spaced along the entire longitudinal extent of the cathode plate.

An elongated supply chamber is operatively connected to, and the at least one additional gaseous precursor material is fed from the supply chamber into selected ones of the spaced manifold assemblies. The supply chamber is preferably an elongated tubular member including one oppositely disposed gas inlet at each of the distal ends thereof. A source of a first additional gaseous precursor material is operatively connected to a first one of the gas inlets whereby the first additional gaseous precursor material is introduced into the supply chamber adjacent the first end of the cathode plate. A source of the second additional gaseous precursor material is operatively connected to the second of the gas inlets whereby the second additional gaseous precursor material is introduced into the supply chamber adjacent the opposite end of the cathode plate. By controlling the flow of the first and second additional gaseous precursor materials into the respective gas inlets of the supply chamber, the extent of the upstream diffusion of the first additional gaseous precursor material through the supply chamber and into the spaced manifold assemblies is correspondingly controlled. The precursor source of semiconductor alloy material is selected from the group consisting essentially of SiH₄ , SiF₄, GeH₄ and mixtures thereof. The first additional gaseous precursor material is selected from the group consisting essentially of BF₃, B₂ H₆, GeH₄ and PH₃. The second additional gaseous precursor material is selected from the group consisting essentially of H₂, Ar, N₂ and mixtures thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a fragmentary, cross-sectional view of a tandem photovoltaic device comprising a plurality of p-i-n type cells, each layer of the cells formed from a semiconductor material;

FIG. 2 is a diagrammatic representation of a multiple glow discharge chamber deposition system adapted for use in the continuous production of photovoltaic devices such as the cells shown in FIG. 1;

FIG. 3A is an enlarged, cross-sectional view of the cathode region of a glow discharge deposition chamber illustrating the gas channeling and introduction assembly previously utilized to achieve a profiled layer of semiconductor alloy material;

FIG. 3B is an enlarged, cross-sectional view of the layer of semiconductor alloy material deposited by the gas channeling and introduction assembly of FIG. 3A, and illustrating the profiling capabilities of that apparatus;

FIG. 4A is an enlarged, cross-sectional view of the cathode region of a glow discharge deposition chamber, similar to the cathode region depicted in FIG. 3A, and illustrating a second gas channeling and introduction assembly previously utilized to achieve a profiled layer of semiconductor alloy material;

FIG. 4B is an enlarged, cross-sectional view of the layer of semiconductor alloy material deposited by the gas channeling and introducing assembly of FIG. 4A, and illustrating the profiling capabilities of that apparatus;

FIG. 5 is an enlarged top plan view of the manifold assemblies and the apertured cathode assembly of the instant invention, as said manifold assemblies and said cathode assembly are operatively disposed adjacent the cathode region of a glow discharge deposition chamber;

FIG. 6 is a cross-sectional view illustrating the manifold assemblies and the cathode assembly depicted in FIG. 5, and specifically illustrating the process gas introduction and channeling system of the present invention; and

FIG. 7 is an enlarged, cross-sectional perspective view of the cathode assembly and the process gas introduction and channelling system depicted in FIGS. 5 and 6.

DETAILED DESCRIPTION OF THE DRAWINGS I. The Photovoltaic Cell

Referring now to the drawings and particularly to FIG. 1, a photovoltaic cell, formed of a plurality of successive p-i-n layers, each of which includes, preferably, an amorphous semiconductor material, is shown generally by the numeral 10. It is for the production of this type of photovoltaic device, wherein amorphous semiconductor layers are continuously deposited onto a continuously moving substrate in isolated deposition chambers, that the process gas introducing and channeling system of the present invention was developed. Note that the term "amorphous" shall be defined herein as an alloy or material which has long range disorder, although it may have short or intermediate range order or even contain, at times, crystalline inclusions.

More particularly, FIG. 1 shows a p-i-n type photovoltaic device such as a solar cell made up of individual p-i-n type cells 12a, 12b and 12c. Below the lowermost cell 12a is a substrate 11 which may be transparent or formed from a metallic material such as stainless steel, aluminum, tantalum, molybdenum, chrome, or metallic particles embedded within an insulator. Although certain applications may require a thin oxide layer and/or a series of base contacts prior to application of the amorphous material, for purposes of this application, the term "substrate" shall include not only a flexible film, but also any elements added thereto by preliminary processing. Also included within the scope of the present invention are substrates formed of glass or a glass-like material on which an electrically conductive electrode is applied.

Each of the cells 12a, 12b and 12c are preferably fabricated with an amorphous semiconductor body containing at least a silicon alloy. Each of the semiconductor bodies includes an n-type conductivity semiconductor, layer 20a, 20b and 20c; an intrinsic semiconductor layer 18a, 18b and 18c; and a p-type conductivity semiconductor layer 16a, 16b and 16c. Note that the intrinsic layer may include traces of n-type or p-type material without forfeiting its characteristic neutrality. As illustrated, cell 12b is an intermediate cell and, as indicated in FIG. 1, additional intermediate cells may be stacked atop the illustrated cells without departing from the spirit or scope of the present invention. Also, although p-i-n cells are illustrated, the process gas introduction and channeling system of this invention may also be used with apparatus adapted to produce single or multiple n-i-p cells.

It is to be understood that following the deposition of the semiconductor layers, a further deposition process may be either performed in a separate environmnet or as a part of a continuous process. In this step, a TCO (transparent conductive oxide) layer 22 is added. An electrode grid 24 may be added to the device where the cell is of a sufficiently large area, or if the conductivity of the TCO layer 22 is insufficient. The grid 24 shortens the carrier path and increases the conduction efficiency.

II. The Multiple Glow Discharge Deposition Chambers

Turning now to FIG. 2, a diagrammatic representation of multiple glow discharge chamber deposition apparatus for the continuous production of semiconductor cells is generally illustrated by the reference numeral 26. The apparatus 26 includes a plurality of isolated, dedicated deposition chambers, each chamber of which is interconnected by a gas gate 42 through which (1) sweep gases, and (2) a web of substrate material 11 are adapted to unidirectionally pass.

The apparatus 26 is adapted to mass deposit amorphous semiconductor layers p-i-n configuration onto the large area surface of the substrate material 11 which is continually fed therethrough. To deposit the semiconductor layers required for producing multiple p-i-n type cells, the apparatus 26 includes at least one triad of deposition chambers. Each triad of deposition chambers comprises: a first deposition chamber 28 in which p-type conductivity semiconductor layer is deposited onto the deposition surface of the substrate 11 as the substrate 11 passes therethrough; a second deposition chamber 30 in which an intrinsic semiconductor layer is deposited atop the p-type layer on the deposition surface of the substrate 11 as the substrate 11 passes therethrough; and a third deposition chamber 32 in which an n-type semiconductor layer is deposited atop the intrinsic layer on the deposition surface of the substrate 11 as the substrate 11 passes therethrough. It should be apparent that (1) although, only one triad of deposition chambers has been illustrated, additional triads or additional individual chambers may be added to the apparatus to provide the machine with the capability of producing photovoltaic cells having any number of p-i-n type semiconductor layers; (2) the process gas introducing and channeling system of the present invention is equally applicable to any production apparatus which includes a moving substrate onto which a semiconductor layer is deposited; (3) the substrate supply core 11a and the substrate take-up core 11b are shown in the deposition chambers for illustrative purposes only, while in reality the cores would be housed in separate chambers operatively connected to the deposition chambers; (4) although the glow discharge illustrated herein employs cathodes with r.f. power, other energy supplies, such as a.c. power generators, microwave generators and d.c. power generators, may be employed without departing from the spirit of the present invention; and (5) the gaseous precursor source of semiconductor alloy material may be introduced by the introduction and channeling system of the present invention to flow in a direction parallel but opposite to the direction of substrate travel.

Each deposition chamber, 28, 30 and 32 of the triad is adapted to deposit a single semiconductor layer, by glow discharge deposition, onto the electrically conductive substrate 11. To that end, each of the deposition chambers 28, 30 and 32 includes: a cathode 34; a shield 35 disposed about each of the cathodes 34; a process gas supply conduit 36; a radio frequency generator or other a.c. power source 38; a process gas and plasma evacuation conduit 41; a plurality of transversely extending magnetic elements 50; a plurality of radiant heating elements shown schematically as 40 in FIG. 2; and a gas gate 42 operatively interconnected the intrinsic deposition chamber to each adjacent dopant chamber. Additionally, an inert sweep gas conduit 37 is disposed on opposed sides of the intrinsic deposition chamber for directing an inert gas toward the dopant deposition chambers.

The supply conduits 36 are operatively associated with the respective cathodes 34 or other decomposition mechanism to deliver process gas mixtures to the plasma, or other decomposition regions created in each deposition chamber between said decomposition mechanism and the substrate 11. The cathode shields 35 are adapted to operate in conjunction with the web of substrate material 11 and the evacuation conduit 41 to confine the process gases within the cathode region of the deposition chambers. To this end, and as will be more fully described hereinafter, the shielding 35 abuts the cathode 34 in a leak-tight manner.

The radio frequency or other similar type of power generator 38 operate in conjunction with the cathodes 34, the radiant heaters 40 and the grounded substrate 11 to form the plasma by disassociating and recombining the elemental reaction gases entering the deposition chambers into deposition species and compounds. These species and compounds are then deposited onto the bottom surface of the substrate 11 as semiconductor layers. The substrate 11 is maintained substantially flat by the plurality of rows of magnetic elements 50 which provide an attractive force urging the substrate 11 upwardly, out of its normal sagging path of travel.

To form the photovoltaic cell 10 illustrated in FIG. 1, a p-type amorphous semiconductor layer is deposited onto the substrate 11 in the dopant deposition chamber 28, an intrinsic amorphous semiconductor layer is deposited atop the p-type layer in the deposition chamber 30 and an n-type amorphous semiconductor layer is deposited atop the intrinsic layer in the deposition chamber 32. As a result, in the preferred embodiment, the apparatus 26 deposits at least three amorphous semiconductor layers onto the substrate 11 with the intrinsic layer deposited in deposition chamber 30 differing in composition from the layers deposited in deposition chambers 28 and 32 by the absence of at least one element which will be referred to as the dopant or doping species.

It is important that each of the semiconductor alloy layers be uniformly deposited across the entire surface of the web of substrate material 11. Therefore, given layers of the deposited material must be developed from specific species and compounds of the gaseous precursor materials, individual species and compounds of which have been subjected to the electromagnetic field for similar lengths of time, thereby depositing material which possesses compositional and bonding characteristics that are adapted to produce uniform semiconductor layers exhibiting a uniform, predetermined range of optical, electrical, and chemical properties across the entire surface of the web of substrate material 11. It is also important that the gas introducing and channeling system of the instant invention be provided with the capability of depositing any preselected profile of dopant material in the host matrix of the semiconductor alloy material. It is to the end of satisfying the above criteria that the process gas introducing and channeling system of the instant invention is directed.

III. The Cathode Assembly With Localized Profiling Capabilities Of The Present Invention

The cathode assembly with localized profiling capabilities of the present invention, fully illustrated in FIGS. 5-7, will be generally referenced by the numeral 70. Referring now to those Figures, the cathode assembly 70 is operably disposed in a deposition chamber which for the purposes of this discussion has been arbritarily selected as the intrinsic deposition chamber 30. Obviously, the improved cathode assembly 70 of the instant invention may, and should, also be employed in the doped deposition chambers 28 and 32 in order to achieve the most uniform flow of gaseous precursor materials through the plasma regions thereof and consequently the most uniform deposition of semiconductor alloy material onto the web of substrate material 11. As a matter of fact, the exemplary cathode assembly 70 illustrated in FIGS. 5-7 is structured so as to have, in the primary embodiment, the capability of introducing the doped additional gaseous precursor material from the introductory manifold assemblies 78 thereof in any specific, localized areas of the plasma region of the deposition chamber 30. Therefore, the cathode assembly 70 is particularly adapted for use in the intrinsic deposition chamber 30 so as to provide for the completely uniform deposition of dopant gaseous precursor materials, in profiled form, into the host matrix of the depositing semiconductor alloy material.

Throughout the description of the first preferred embodiment which follows, it is important to remember that the direction of flow of the gaseous semiconductor alloy precursor material through the decomposition region of the deposition chamber 30 is depicted by the reference arrow C, while the direction of travel of the web of substrate material 11 therethrough is depicted by the reference arrow A. The flow of the gaseous precursor semiconductor material is, therefore, substantially parallel to the direction of movement of the web of substrate material 11 through the decomposition region of the deposition chamber 30.

Obviously, the cathode assembly 70 of the instant invention is equally well suited for use with apparatus adapted for the deposition of other types of material by other processes, such as the deposition of organic polymers by chemical vapor deposition. The adaptation of the instant cathode assembly 70 for other deposition processes simply requires that the direction of flow of the primary gaseous precursor material through the apparatus for practicing the particular deposition technique is in a direction substantially parallel to the direction of movement of the web of substrate material 11. After providing for such parallel flow, the secondary gaseous precursor materials may be introduced into the decomposition region of the particular deposition apparatus in only localized areas so as to provide for the deposition of a uniform layer of those secondary gaseous precursor materials in the host matrix of the primary gaseous precursor material.

While, as noted in the preceding paragraph, the first preferred embodiment of the invention utilizes an introductory flow of the gaseous semiconductor alloy precursor material through the decomposition region of a deposition chamber, which flow is substantially parallel t the movement of the web of substrate material therethrough, a second preferred embodiment of the instant invention exists in which the gaseous semiconductor alloy precursor material is introduced into the decomposition region of the deposition chamber through the apertured cathode plate, described hereinafter. By utilizing an introductory flow of the gaseous semiconductor alloy material through the apertured cathode plate of the instant invention, (1) said gaseous semiconductor alloy precursor material cannot be depleted in the plasma region, (2) adjacent sections of the plasma region can be tailored to contain precisely selected percentages of gaseous precursor materials, and (3) the length of the cathode plate, even the cathode plate in the intrinsic deposition chamber, does not interfere with the introduction of precisely selected percentages of the gaseous precursor dopant material.

The deposition chamber 30 is generally a rectangularly-shaped, box-like member which includes a bottom wall 70a, a top wall 70b, side walls 70c and 70d, and a back wall not shown. Disposed interiorly of the deposition chamber 70 and approximately midway between the upper wall 70b and the lower wall 70a, is the novel and improved cathode assembly 70 of the instant invention. The cathode assembly 70 includes a cathode plate 34 adapted to receive power from the power source 38 (see FIG. 2) for generating a plasma from the gaseous precursor materials adapted to flow between said cathode plate 34 and the moving web of substrate material 11. The web of substrate material 11 is preferably disposed above and in a plane generally parallel to the plane of the cathode plate 34. More particularly, the web of substrate material 11 is adapted to enter the deposition chamber 30 from a downstream substrate entry port (downstream relative to the flow of gaseous precursor semiconductor alloy material through the decomposition region) and exit from the deposition chamber 30 through an upstream substrate exit port. In this manner, the web of substrate material 11 travels through the exit and entry ports of the deposition chamber just above the generally horizontally disposed shoulders 72a and 72b which are formed at the upper extent of the generally vertically disposed legs 74a and 74b, respectively. The vertical legs 74a and 74b are securely fastened to the side walls 70c and 70d, respectively, of the deposition chamber 30.

The deposition chamber 30 includes a gaseous precursor semiconductor alloy material supply manifold 36a which is adapted to introduce, for instance, the intrinsic semiconductor alloy material into the deposition chamber 30 and a secondary supply manifold 36b which is adapted to introduce a secondary gaseous intrinsic semiconductor alloy material into the deposition chamber 30. For instance, the primary supply manifold 36a might be employed to introduce silane gas or silicon tetrafluoride gas while the secondary supply manifold 36b might be employed to introduce hydrogen gas or germane gas for decomposition upon entering the plasma region. The supply manifolds 36a and 36b are both elongated, transversely extending, tubular members having apertures spaced along the full length thereof so as to uniformly introduce the respective primary and secondary gaseous precursor materials into the deposition chamber 30 across the entire width of the web of substrate material 11. Of course, the entire width of the web of substrate material 11 corresponds to the entire width of the cathode plate 34. Consequently, the primary and secondary gaseous precursor semiconductor alloy materials are introduced into the decomposition region along the entire transverse width of the area of the deposition chamber in which a plasma is to be developed.

The process gas introduction and channeling system is formed by gas directing shielding 35 which extends across the width of the deposition chamber 30 and which has a generally horizontally disposed base support member 35a and spaced, generally vertically disposed and upwardly extending cathode supporting legs 35b. The cathode supporting legs 35b are adapted to closely abut, in leak-tight fashion, the bottom surface 34c of the cathode plate 34. In order to insure that all additional gaseous precursor materials introduced into the compartment 76 formed between the cathode plate 34 and the base support member 35a of the gas directing shielding 35 can be subsequently introduced into the decomposition region only through the apertures 90 formed through the cathode plate 34, the junction formed between the upright legs 35b of the shielding 35 and the bottom surface 34c of the cathode plate 34 is adapted to prevent the leakage of gaseous precursor material through that non-welded junction. In this manner, (1) gaseous precursor semiconductor alloy material cannot leak through that junction and bypass the prescribed path of travel from the introductory manifolds 36a and 35b to and through the decomposition region to finally exit through the exhaust 41, thereby creating areas of gas stagnation and depletion in the decomposition region (which areas of gas stagnation would result in the deposition of nonuniform layers of semiconductor alloy material), (2) secondary additional gaseous precursor materials cannot enter from the secondary gas manifolds 78 in compartment 76 into undesirable, non-localized areas of the decomposition region, thereby resulting in undesirable profiles of the secondary gaseous species in the host matrix of the semiconductor alloy material, and (3) spent gaseous precursor materials and non-deposited plasma cannot flow from the decomposition region back into the introductory region adjacent manifolds 36a and 36b, thereby creating the possibility of passing spent gaseous precursor materials and non-deposited plasma through the decomposition region a second time. The gas directing shielding 35 further includes a generally vertically oriented leg 35c adapted to (1) support the horizontal support member 35a above the surface of the bottom wall 70a of the deposition chamber 30 for the purposes described hereinafter, and (2) divide the bottom portion of the deposition chamber 30 into gas introductory and gas exhaust segments. The vertical leg 35c is formed to be generally coextensive with the width of the cathode plate 34 so as to fully isolate the introduction of gaseous precursor materials into the decomposition region from the exhaust of those gaseous precursor materials from the decomposition region.

Further note that a precathode assembly such as that shown in FIG. 7 as rod 66, may be disposed downstream of the gaseous precursor semiconductor alloy introductory manifolds 36a and 36b. The precathode rod 66 is adapted to begin the initial disassociation and recombination of gaseous precursor material flowing therepast, as well as forming part of the system which collects impurities from the gaseous precursor material and contaminants from the walls of the deposition chamber 30 so as to prevent the contaminants and impurities from being deposited along with the semiconductor alloy material onto the web of substrate material 11. Note that the use of such an upstream cathode assembly has been fully described in assignee's previously mentioned U.S. Pat. No. 4,479,455 filed Mar. 14, 1983 and need not be further detailed herein.

The introduction and channeling system also includes a plurality of substantially equally spaced banks 68a-68c of heating elements, generally 68. Each of the banks 68a-68c includes a heat reflective shield 69a-69c, respectively, to direct the heat from the heating elements 68 toward the introduced gaseous precursor material and the cathode assembly 70 operatively disposed thereabove. The number and spacing of the banks of heating elements 68a-68c, as well as the number and spacing of the individual heating elements 68 in each bank depicted FIG. 7, while not critical, should be sufficient to prewarm the gaseous precursor materials flowing therepast to a predetermined temperature. Although not illustrated in FIG. 7, another array of heating elements, schematically depicted in FIG. 2 by the reference numeral 40, is disposed above the plurality of elongated, spaced, ceramic bar magnets 50, which magnets 50 are supported across the width of the deposition chamber 30 atop oppositely disposed and longitudingly extending magnet support shelves 50a, only one of which is illustrated. The upper array of heating elements 40 are adapted to warm the web of substrate material 11 to the predetermined deposition temperature, while the bar magnets 50 are adapted to urge the magnetic web of substrate material 11 upwardly, into sliding contact therewith.

Referring now to the improved cathode assembly 70 of the instant invention, which assembly is particularly adapted to provide for the localized profiling of depositing semiconductor alloy material onto the web of substrate material 11 continuously passing through the decomposition region of a deposition chamber such as 30, it should be noted that the additional gaseous precursor material introductory compartment 76 is bounded by the spaced upright legs 35b, the bottom support member 35a of the cathode shield 35 and the bottom surface 34c of the cathode plate 34 so as to define an enclosure only about 1/8 inch high. It is within this compartment 76 that the first and second additional gaseous precursor materials as well as third and fourth gaseous precursor materials may be introduced and fed through the approximately 1/32 inch diameter apertures 90 of the cathode plate 34 (the apertures may preferably form about 30% of the cathode plate) into the specific localized areas of the plasma region of the deposition chamber 30.

Operatively disposed within the compartment 76 are a plurality of additional gaseous precursor introduction manifold assemblies generally referred to by the reference numeral 78. Each of the manifold assemblies 78 includes an adjacent gas receiving manifold 78a and a gas delivery manifold 78b interconnected by a relatively small diameter capillary tube 78c, said tubes having inner diameter of about 10 mils and being about 1/2 inch long. Atop and randomly spaced about the plurality of the manifold assemblies 78 are disposed a plurality of dielectric insulating sheets, such as glass plates 79, for insulatingly spacing and supporting the manifold assemblies 78 from the cathode plate 34. Further, by maintaining a distance between the bottom of the cathode plate 34 and the top of the manifold assemblies 78 of less than the dark space, a plasma cannot be generated between said energized cathode plate 34 and said manifold assemblies 78.

Each of the gas receiving and the gas delivery manifolds 78a and 78b, respectively, are generally rectangularly shaped members extending transversely across the entire width of the cathode plate 34. The gas receiving manifold 78a includes a central bore 80, approximately 1/16 inch in diameter, extending along the entire longitudinal length thereof and hence extending across the entire transverse length of the cathode plate 34. The gas delivery manifold 78b includes a plurality of spaced, generally rectangularly shaped slots 82, the front face of each of which is open so as to feed additional gaseous precursor materials therefrom into the compartment 76. The rectangular slots 82 are generally approximately 1/16 inch high and 1/2 inch wide, and are equally spaced along the entire length of the gas delivery manifold 78b so as to extend across the entire transverse width of the cathode plate 34.

Note that while the slots 82 have been described as having front faces which are open, said front faces may be operatively disposed in a plurality of different attitudes. More particularly, in a first preferred embodiment, the front faces may be disposed so as to initially direct the additional gaseous precursor material emanating therefrom in a sideward direction (the direction illustrated in FIG. 7). While, in this manner, the additional gaseous precursor materials may be confined in localized sub-compartments such as 76a-76h, for preselected localized introduction into only at least localized areas of the decomposition region of the deposition chamber 30, as will be more fully explained hereinafter, alternate attitudes are also within the spirit and scope of the instant invention. For example, in a first alternate embodiment, the open face of the rectangular slots 82 in the gas delivery manifold 78b of the manifold assemblies 78 may be operatively disposed to open downwardly toward the bottom support member 35a of the compartment 76, or the rectangular slots 82 in the gas delivery manifolds 78b may be operatively disposed with the faces thereof opening toward both sides of the individual gas delivery manifolds 78. It is important to note that because the pressure within the introductory compartment 76 is substantially equal to the pressure within the decomposition region and the height of the compartment 76 is only about 1/8 inch, almost all of the additional gaseous precursor materials emanating from any given gas delivery manifold will be introduced through the apertures 90 most directly above the sub-compartment 76a-76h from which said materials enter the introductory sub-compartment 76. Therefore, the particular gaseous precursor mixtures introduced into any given sub-compartment 76a-76h are not able to diffuse into adjacent sub-compartments, thereby providing for the introduction of particular gaseous precursor mixtures into preselected localized areas of the plasma region.

Regardless of the direction in which the open face of the rectangular slots 82 of the gas delivery manifolds 78b are directed, the additional gaseous precursor materials are fed from at least one elongated supply chamber 84 (see FIG. 5) which is operatively disposed so as to be positioned adjacent to and extend substantially coextensive with the cathode plate 34. The supply chamber 84 is an elongated, tubular member of about 10 square centimeters cross-sectional area and including one of the oppositely disposed gas inlets 84a at one of the distal ends thereof. A source of a first additional gaseous precursor material 86 is operatively connected to a first one of gas inlets 84a for introducing the first gaseous precursor material into the supply chamber 84 which is operatively disposed adjacent a first end of the cathode plate 34. A source 88 of a second additional gaseous precursor material is operatively connected to the second of the gas inlets 84b for introducing the second additional gaseous precursor material into the supply chamber 84 which is operatively disposed adjacent the longitudinally opposite end of the cathode plate 34.

In other words, the supply chamber 84 is adapted to extend coextensively along the longitudinal extent of the cathode plate 34 so as to introduce the additional gaseous precursor materials, through feed lines 83, into the plurality of gas receiving manifolds 78a which in turn feed the additional gaseous precursor material through the central bore 80 thereof and through the small diameter capillary tubes 78c into a through bore 81 running through the longitudinal extent of the gas delivery manifolds 78b. The bore 81 communicates with each of the rectangular slots 82 in the gas delivery manifolds 78b to introduce said additional gaseous precursor material into the sub-compartments 76a-76h formed interiorly of additional gaseous precursor material introductory compartment 76. That additional gaseous precursor material introduced into specific ones of the sub-compartments 76a-76h immediately diffuses upwardly through the localized apertures 90 which have been formed through the cathode plate 34. In this manner, the additional precursor gaseous materials are specifically introduced from the supply chamber 84 into only preselected and localized areas of the plasma region. Note that the additional gaseous precursor material introduced into any one of the sub-compartments 76a-76h will diffuse through the apertures 90 in the cathode plate 34 located immediately thereabove because said material is only 1/8 inch area from those localized apertures 90 (the approximate height of compartment 76), vis-a-vis, the 1 inch length to the adjacent point of introduction of a different concentration of the additional gaseous precursor materials.

As to a more comprehensive explanation of the manner in which the additional gaseous precursor materials are introduced at only specifically desired preselected sites within the plasma region, note the following. This specificity of introduction is accomplished with the gas introducing and channeling apparatus of the instant invention by simply controlling the flow rate of the first additional gaseous precursor material into the gas inlet 84a of the supply chamber 84 relative to the flow rate of the second additional gaseous precursor material into the gas inlet 84b of the supply chamber 84. More particularly, by establishing a very low flow rate of, for instance, boron trifluoride from the first additional gaseous precursor material source 86 into the gas inlet 84a of the supply chamber 84 and a very high flow rate of, for instance, hydrogen gas from the second additional gaseous precursor material source 88 into the gas inlet 84b of the gas chamber 84, the flow of the boron trifluoride gas will be diffusion limited in the upstream distance from downstream gas inlet 84a that said BF₃ is able to diffuse against the flow of hydrogen gas before being evacuated from the supply chamber 84. More particularly, with such a low rate of flow of BF₃ and a high rate of flow of H₂, the BF₃ will most predominantly flow into the first (most downstream) manifold assembly 78', with perhaps trace amounts of boron trifluoride entering the more downstream upper manifold 78" and practically no boron trifluoride reaching and entering the still further downstream upper manifold 78"'. In this manner, it should be apparent that the boron trifluoride can be restricted to enter only preselected localized areas of the downstream portion of the plasma region of the deposition chamber 30 so as to provide the capability of forming either a profiled or a uniform layer of p-doped semiconductor alloy material across the entire width of the web of substrate material 11. Once entering the plasma region, the boron trifluoride is restricted to that localized area of the plasma region from which it is introduced through the apertured cathode plate 34 because the boron trifluoride cannot diffuse too far upstream against the strong counter-flow of the gaseous precursor semiconductor material. Finally, note that in the preferred embodiment, the lower surface of the manifold assemblies 78 abut the lower support member 35a and the individual glass plates 79 abut the cathode plate 34 to thereby form the plurality of substantially discrete sub-compartments 76a-76i.

Alternatively, if it is desired to obtain a more gradual profile of the p-doped semiconductor alloy material, the flow rate of the secondary additional gaseous precursor material from the source 88 can be reduced and the flow rate of the primary gaseous precursor material from the source 86 can be increased so that an additional quantity of the primary gaseous precursor material is able to diffuse upstream in the supply chamber 84 and more primary gaseous precursor material is introduced into (1) the most upstream manifold assembly 78, with decreasing amounts (but greater than the amounts introduced in the preceeding paragraph) introduced into (2) manifold assembly assembly 78" and yet further decreasing the amounts introduced into (3) the further upstream manifold assembly 78"'. The important point is that the amount of secondary gaseous precursor material introduced into any given localized area of the plasma region of the deposition chamber 30 would be specifically set and controlled by the operator and would not be dependant upon the more unreliable diffusion techniques which were previously described with reference to the embodiments illustrated in FIGS. 3A and 4A. In this manner, such uncontrollable factors as the tendency of the web of substrate material 11 to sag or canoe as it travels through the plasma region of the deposition chamber 30 will no longer limit the reliability of attempting to set a preselected profile of secondary species in the host matrix of the semiconductor alloy material.

It should finally be noted that a second elongated, tubular supply chamber 84' can be operatively disposed so as to be positioned on the opposite side of cathode plate 34 of the supply chamber 84 and substantially coextensive with that cathode plate 34. The feed lines 83' from the second supply chamber 84' are adapted to introduce third and fourth additional gaseous precursor materials into the manifold assemblies 78a which are alternately disposed with the manifold assemblies 78 of the first supply chamber 84. By so operatively positioning said second supply chamber 84' adjacent the cathode plate 34, the third additional gaseous precursor material, such as germane, can be introduced from the source 90 thereof into the third gas inlet 84a' of the supply chamber 84' and the fourth additional gaseous precursor material, such as argon, can be introduced from the source 92 thereof into the fourth gas inlet 84b' of the supply chamber 84'. Then by simply setting the relative flow rates of the third and fourth additional gaseous precursor materials into the supply chamber 84', said materials can be introduced into only the precisely desired and localized areas of the plasma region of the deposition chamber 30 so as to obtain the exact preselected profile or uniform layering of those third and fourth materials in the host matrix of the depositing semiconductor alloy material.

It should be understood that the present invention is not limited to the precise structure of the illustrated embodiments. It is intended that the foregoing description of the presently preferred embodiments be regarded as an illustration rather than as a limitation of the present invention. It is the claims which follow, including all equivalents, which are intended to define the scope of this invention. 

What is claimed is:
 1. An improved assembly for the glow discharge deposition of thin film layers of semiconductor alloy material onto a substrate including: means adapted to continuously move said substrate through a plasma region formed within said chamber between the substrate and an apertured cathode spacedly positioned adjacent thereto; introduction manifold disposed remotely of the plasma region for introducing at least one gaseous precursor source of semiconductor alloy material into the plasma region; exhaust means disposed remotely of said plasma region; means for channeling the gaseous precursor source through the plasma region in a direction of travel substantially parallel to the direction of movement of the substrate, said channeling means including shield means for directing the gaseous precursor source from the introduction manifold disposed remotely of the plasma region, through the plasma region and through the exhaust disposed remotely of the plasma region; the improvement comprising, in combination:means for introducing at least a first additional gaseous precursor material through the apertures in the cathode into at least only localized areas of the plasma region so as to deposit any preselected profile of the first additional gaseous precursor material into the depositing layer of semiconductor alloy material.
 2. An assembly as in claim 1, further including means for introducing at least a second additional gaseous precursor material into at least only localized areas of the plasma region so as to deposit any preselected profile of the second additional gaseous material into the depositing layer of semiconductor alloy material.
 3. An assembly as in claim 1, wherein the substrate is an elongated web and the assembly further includes an elongated, generally planar cathode operatively spaced from the web, whereby a plasma is developed as the gaseous precursor materials flow through the space between the web and the cathode.
 4. An assembly as in claim 3, further including shield means for directing the gaseous precursor semiconductor material to flow from an introduction manifold disposed beneath the cathode plate, around a first edge of the cathode plate, into and through the plasma region formed across the top surface of the cathode plate, around the distal edge of the cathode plate and through an exhaust disposed beneath the cathode plate.
 5. An assembly as in claim 4, further including at least one manifold means adapted to introduce the first additional gaseous precursor material into the at least only localized areas of the plasma region.
 6. An assembly as in claim 5, wherein each of the at least one manifold means are elongated members operatively disposed so as to extend transversely across the entire width of the cathode.
 7. An assembly as in claim 6, wherein each of the at least one manifold means includes a plurality of spaced outlets for introducing the at least one additional gaseous precursor material into the plasma region, said outlets spaced along the entire length of the manifold means so that said additional gaseous precursor material is introduced into at least one localized area of the plasma region, which area is coextensive with the width of the cathode plate.
 8. An assembly as in claim 3, wherein a plurality of manifold means are spacedly disposed beneath the cathode plate, said manifold means being spacedly positioned so as to extend along at least a portion of the longitudinal extent of the cathode plate.
 9. An assembly as in claim 1, wherein the manifold means are spacedly disposed along the entire longitudinal extent of the cathode plate.
 10. An assembly as in claim 9, further including an elongated supply chamber operatively connected to each of the spaced manifold means and from which the at least one additional gaseous precursor material may be fed into selected ones of the spaced manifold means.
 11. An assembly as in claim 10, wherein the supply chamber is an elongated tubular member including at least one oppositely disposed gas inlet at each of the distal ends thereof.
 12. An assembly as in claim 11, further including a source of a first additional gaseous precursor material operatively connected to a first one of the gas inlets, whereby the first additional gaseous precursor material is introduced into the supply chamber adjacent a first end of the cathode plate; and a source of a second additional gaseous precursor material operatively connected to the second of the gas inlets, whereby the second additional gaseous precursor material is introduced into the supply chamber adjacent the opposite end of the cathode plate.
 13. An assembly as in claim 12, further including means for controlling the flow of the first and second additional gaseous precursor materials into the respective gas inlets of the supply chamber, whereby the extent of the upstream diffusion of the first additional gaseous precursor material is controllable by setting the relative flow rates of the first and second additional gaseous precursor materials into the supply chamber.
 14. An assembly as in claim 12, wherein the gaseous precursor source of semiconductor alloy material is selected from the group consisting essentially of SiH₄, SiF₄, GeH₄, and mixtures thereof.
 15. An assembly as in claim 14, wherein the first additional gaseous precursor material is selected from the group consisting essentially of BF₃, B₂ H₆, GeH₄ and PH₃.
 16. An assembly as in claim 15, wherein the second additional gaseous precursor material is selected from the group consisting essentially of H₂, Ar, N₂ and mixtures thereof. 